HCT-900-Hand held convection tool
HCT-900 Handheld Convection Tools HCT-900 Handheld Convection Tools provide low-cost, multi-purpose rework solutions for a variety of production and rework application challenges: rework pinhole equipment for a variety of simple or complex SMT parts, such as sockets and connectors used in conjunction with tin suction tape and flux to remove solder bridges and tin slag plastic materials, such as attaching shrink plastic packaging to parts.
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HCT-900 hand-held convection tool
HCT-900 hand-held convection tools provide low-cost, versatile rework solutions for a variety of production and rework application challenges:
- Rework a wide variety of simple or complex SMT components
- Rework pinhole equipment, such as sockets and connectors
- Used in conjunction with solder strip and flux to remove solder bridges and tin dross
- Applications in plastic materials, such as attaching shrink plastic packaging to components
| Main features and advantages |
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A closed-loop feedback circuit allows the system to reach and maintain the desired temperature regardless of whether the amount of airflow changes. |
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| Part Number | Description | |
| HCT-900-11 |
115 V Handheld Convection Tool |
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| HCT-HE-11 |
Heating element, replacement, 115 V |
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| HCT-900-21 |
230 V Hand Held Convection Tool |
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| HCT-HE-21 | Heating element, replacement, 230 V | |
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HCT-900 can be used to remove and replace electronic components, including lead-free soldering, from 0201 to 304 pin QFP. |
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| Choice of nozzle | ||
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The HCT-900 is also equipped with a standard single-hole H-D50(0.2 inches, 5.0mm) suction nozzle. Also provided |
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| NZKT-1 |
Nozzle kit for wafer resistor, SOIC and TSOP packaging. |
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| NZKT-2 |
Nozzle kit for PlCC, QFP and BQFP. |
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| Model | Chip Type | A mm (inch) | B mm (inch) | |
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H-P20 | PLCC-20 | 11.9 (0.47") | 11.9 (0.46") |
| H-P28 | PLCC-28 | 14.5 (0.57") | 14.5 (0.57") | |
| H-P32 | PLCC-32 | 16.9 (0.67") | 14.3 (0.56") | |
| H-P44 | PLCC-44 | 19.5 (0.77") | 19.5 (0.77") | |
| H-P52 | PLCC-52 | 21.0 (0.83") | 21.0 (0.83") | |
| H-P68 | PLCC-68 | 27.1 (1.07") | 27.1 (1.07") | |
| H-P84 | PLCC-84 | 32.4 (1.28") | 32.4 (1.28") | |
| H-Q07 | QFP-48 | 8.4 (0.33") | 8.4 (0.33") | |
| H-Q10 | QFP-44 | 13.4 (0.53") | 13.4 (0.53") | |
| H-Q14 | QFP-52,80 | 17.3 (0.68") | 17.3 (0.68") | |
| H-Q1420 | QFP-64,80,100 | 23.4 (0.92") | 18.1 (0.71") | |
| H-Q28 | QFP-120,128,144,160 | 31.2 (1.23") | 31.2 (1.23") | |
| H-BQ23 | BQFP-100 | 22.4 (0.88") | 22.4 (0.88") | |
| H-Q3232 | QFP-240 | 34.5 (1.36") | 34.5 (1.36") | |
| H-BQ38 | BQFP-196 | 37.7 (1.48") | 37.7 (1.48") | |
| H-Q2626 | QFP-208 | 29.8 (1.17") | 29.8 (1.17") |
| Model | Chip Type | A mm (inch) | B mm (inch) | |
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H-S16 | SOIC 14,16 | 6.8 (0.27") | 10.2 (0.4") |
| H-SL16 | SOL 14,16 | 10.6 (0.41") | 10.8 (0.43") | |
| H-SL20 | SOL 20,20J | 10.6 (0.41") | 13.3 (0.52") | |
| H-SL24 | SOL 24,24J | 10.6 (0.41") | 15.9 (0.63") | |
| H-SL28 | SOL 28 | 10.6 (0.41") | 18.4 (0.72") | |
| H-SL44 | SOL 44 | 16.0 (0.41") | 27.9 (1.1") | |
| H-SOJ32 | SIG 32. | 13.5 (0.53") | 20.6 (0.81") | |
| H-SOJ40 | SGI 40. | 13.5 (0.53") | 25.4 (1.0") | |
| H-TS24 | TSOP 20-24 | 17.0 (0.67") | 7.1 (0.28") | |
| H-TS32 | TSOP 28-32 | 21.0 (0.83") | 9.1 (0.36") | |
| H-TS40 | TSOP 40 | 21.0 (0.83") | 10.8 (0.43") | |
| H-TS48 | TSOP 48 | 21.0 (0.83") | 13.3 (0.52") | |
| H-TSW24 | TSOP 20-24 | 10.2 (0.4") | 18.4 (0.72") | |
| H-TSW44 | TSOP 24-28/40-44 | 12.7 (0.5") | 19.8 (1.78") |
| Model | A mm (inch) | |||
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H-D25 | 2.5mm (0.1 inches) | ||
| H-D50 | 5.0mm (0.2 inches) | |||
| H-D120 | 12.0mm (0.47 inches) | |||
| Technical Specifications | |
| Input line voltage |
230 V HCT-900-21 / 115 V HCT-900-11 |
| Power | 320W |
| Air pump type | diaphragm type |
| Air flow | 6-25 l/min |
| Control temperature | 100 °C - 500 °C (212 °F - 932 °F) |
| Dimensions | 210 x 170 x 140mm (8.7 "x 6.7" x 5.5 ") |
| Noise level | Less than 46 dBA |
| surface resistance | Device: 105 - 106Ohm. Handle and tube: 107 - 1011Ohm |
| Weight | 4.7kg(10.4 lbs) |
| Certificate/Proof | CTUVus, CE |
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