Series of products for electronic industry

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Please refer to the product selection table to select the appropriate product for the material and application scope of the Electronicindustrialuseadhesiveseries of the special purpose series products in the electronic industry.

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LETBOND adhesive

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Electronic industry special purpose products

Electronic industrial use adhesive series

Product Number	Then the material and the scope of application	Color	Viscosity (CP)	Preliminary Cure (min)/Complete Cure (hrs)	Shear strength (kgf/cm²)	Temperature resistance range (℃)
1120	Suitable for thick film circuits, porous substrates and printed circuit boards, moisture and static resistance. The PCB applied to LED lamps is moisture-proof.	yellow-green liquid	650~950	25 ℃ / 7min / 72	-	-45~ 200
1331	PCB circuit board surface moisture-proof, anti-static coating glue, can be used for spraying, soaking, brushing and other ways of gluing.	Transparent (can be inspected with fluorescent lamps)	300~350	10-15 / 24	-	-55~ 125
29230B	Single-agent moisture-hardening potassium-silicon polymer, universal, fast curing, good adhesion to metals, plastics and rubber, impact resistance.	Black	135,000	7/24	>30	-60~ 120
29230C	Single-agent moisture-hardening potassium-silicon polymer, universal, fast curing, good adhesion to metals, plastics and rubber, impact resistance.	Transparent	135,000	7/24	>30	-60~ 120
29231	Solvent-free elastic adhesive, fast curing, suitable for plastic and rubber.	Black	64,000 ~ 96,000	10/12	>30	-60~ 120
29231B	Solvent-free elastic adhesive, fast curing, suitable for plastic and rubber.	Black	64,000 ~ 96,000	10/12	>30	-60~ 120
29231BL	Solvent-free elastic adhesive, fast curing, suitable for plastic and rubber.	Black	16,000 ~ 24,000	10/12	>30	-60~ 120
29231C	Solvent-free elastic adhesive, fast curing, suitable for plastic and rubber.	Yellowish Translucent	66,000 ~ 99,200	10/24	>30	-60~ 120
29231W	Solvent-free elastic adhesive, fast curing, suitable for plastic and rubber.	White	65,600 ~ 98,400	10/12	>30	-60~ 120
29232B	Single agent silica gel, fast curing at room temperature, no corrosion of electronic components, high voltage resistance.	Black	48,000 ~ 72,000	5/24	>10	-60~ 250
29232C	Single agent silica gel, fast curing at room temperature, no corrosion of electronic components, high voltage resistance.	Transparent	48,000 ~ 72,000	5/24	>10	-60~ 250
29234	Odorless, low shrinkage, fast curing, can be used for follow and seal, high strength follow.	Black	50,000 ~ 100,000	5/24	>15	-60~ 232
29236	Fast curing PU glue, multi-purpose, impact resistance.	Transparent	48,000 ~ 72,000	5/24	>30	-40~ 66
29237B	The new elastic polymer sealant has high adhesion properties and a wide range of applications, suitable for thin layer and surface coating.	Black	560,000 ~ 720,000	15~20/24	>22	-40~ 80
29238	Room temperature curing, low odor, used for sealing and sealing, suitable for glass, metal, concrete and many building materials, non-corrosive metal.	Transparent/White/Black/Grey Light gray/dark brown/aluminum gray	Paste	10/48	>4	-48~ 149
3332	Low mobility for substrates and dipoles, transistors, gate fluids, heat sinks, silicone rectifiers and semiconductors, automatic thermostats, power resistors and heat sinks.	White	Paste	No curing	-	-55~ 180
8764	Double agent acrylic adhesive, multi-purpose, impact resistance, high strength.	GreyWhite	100,000	Volume ratio = 1:1 10~12/24	>150	-40~ 180
8765	Double agent acrylic adhesive, multi-purpose, impact resistance, high strength.	GreyWhite	100,000	Volume ratio = 1:1 20~25/24	>150	-40~ 180
8766	Two-type black Epoxy sealant, IC chip component package protection.	Black	40,000	30~90/24	>210	-55~ 120
8767	Epoxy resin adhesive, A/B two-liquid type, easy to operate, suitable for infusion or surface coating of electronic parts industry.	Black	4,500 ~ 5,500	Weight ratio = 4:1 35	>132	-40~ 120
8775	It has good operability, good toughness and disturbance after hardening, and can maintain a good state when potting electronic components, and will not diffuse any vertical flow due to the process of heating and hardening.	Main agent milky white Agent B slightly yellow	Main agent 16,000 ~ 26,000 Agent B <200	Weight ratio = 1:1 9/24	>150	-40~ 120
9005-EC	Conductive silver glue, high viscosity, high conductivity, high thermal conductivity, suitable for LED chip.	Silver	8,300 ~ 12,500	80℃ 30min/ 175℃ 60min	>80	-40~ 250
9008-EC	Conductive silver adhesive, suitable for ITO glass, ITO film, glass substrate and metal, medium strength, high conductivity.	Silver	9,000 ~ 13,000	130℃ 30min/ 80℃ 60min	>100	-40~ 120